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Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm

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Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm

Brand Name : Bicheng

Model Number : BIC-506.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : High Tg, Lead Free High Reliability Epoxy Resin

Layer count : Double Layer, Multilayer, Hybrid PCB

PCB thickness : 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm

PCB size : ≤400mm X 500mm

Solder mask : Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.

Copper weight : 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)

Surface finish : Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..

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High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

General Description

IT-180ATC is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance. It’s suitable for various applications and can pass 260℃ lead free assembly. Thickness ranges 0.5mm to 3.2mm, copper weight 0.5oz to 3oz.

Applications

-Automotive (Engine room ECU)

-Multilayer and HDI PCB

-Backplanes

-Data Storage

-Server and Networking

-Telecommunications

-Heavy Copper

Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm

Key Features

-Low CTE

-High heat resistance

-Excellent CAF resistance

-Good through-hole reliability

Our PCB Capability (IT-180ATC)

PCB Material: High Tg, Lead Free High Reliability Epoxy Resin
Designation: IT-180ATC
Dielectric constant: 4.4 at 1GHz
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

General Properties of IT-180ATC

Items IPC TM-650 Typical Value Unit
Peel Strength, minimum 2.4.8 lb/inch
A. Low profile copper foil 5
B. Standard profile copper foil 8
Volume Resistivity 2.5.17.1 1x109 M-cm
Surface Resistivity 2.5.17.1 1x108 M
Moisture Absorption, maximum 2.6.2.1 0.1 %
Permittivity (Dk, 50% resin content) --
A. 1MHz 2.5.5.9 4.5
B. 1GHz 2.5.5.9 4.4
Loss Tangent (Df, 50% resin content) --
A. 1MHz 2.5.5.9 0.014
B. 1GHz 2.5.5.9 0.015
Flexural Strength, minimum N/mm2
A. Length direction 2.4.4 500-530
B. Cross direction 410-440
Thermal Stress 10 s at 288°C
A. Unetched 2.4.13.1 Pass Rating
B. Etched Pass
Flammability UL94 V-0 Rating
Comparative Tracking Index (CTI) IEC 60112 / UL 746 CTI 3 (175-249) Class (Volts)
Glass Transition Temperature(DSC) 2.4.25 175 ˚C
Decomposition Temperature 2.4.24.6 345 ˚C
X/Y Axis CTE (40℃ to 125℃) 2.4.41 11-13 / 13-15 ppm/˚C
Z-Axis CTE
A. Alpha 1 45 ppm/˚C
B. Alpha 2 2.4.24 210 ppm/˚C
C. 50 to 260 Degrees C 2.7 %
Thermal Resistance
A. T260 2.4.24.1 >60 Minutes
B. T288 20 Minutes

Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm


Product Tags:

Multi Layer FR4 PCB Board

      

Lead Free PCB Printed Circuit Board

      

400mmX500mm Printed Circuit Board

      
Wholesale Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm from china suppliers

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