Leveraging Rogers RO4360G2, a low-loss, glass-reinforced hydrocarbon ceramic thermoset material, this 2-layer rigid PCB is purpose-built for high-frequency telecom applications—specifically base station power amplifiers and small cell transceivers.
PCB Specification
| Parameter | Details |
| Base Material | Rogers RO4360G2 – Low-loss, glass-reinforced hydrocarbon ceramic thermoset; first high-Dk thermoset laminate processable like FR-4 |
| Layer Count | 2 layers (rigid structure) |
| Board Dimensions | 73.12mm x 44.71mm per piece (1PCS), |
| Minimum Trace/Space | 5 mils (trace) / 6 mils (space) |
| Minimum Hole Size | 0.30mm |
| Vias | No blind vias; via plating thickness = 20 μm – Ensures low |
| Finished Board Thickness | 0.9mm |
| Finished Copper Weight | 1oz (1.4 mils) for outer layers |
| Surface Finish | Immersion Gold |
| Silkscreen | White silkscreen on top layer; no silkscreen on bottom layer |
| Solder Mask | Green solder mask on top layer; no solder mask on bottom layer |
| Quality Assurance | 100% electrical testing prior shipment |
PCB Stack-up
The stack-up is engineered to maximize RF performance and thermal reliability, leveraging RO4360G2’s high Dk and copper-matched thermal expansion:
| Layer Name | Material | Thickness |
| Top Layer (Copper_layer_1) | 35 μm thick copper | 35 μm (1oz) |
| Substrate Layer | Rogers RO4360G2 | 0.813mm (32mil) |
| Bottom Layer (Copper_layer_2) | 35 μm thick copper | 35 μm (1oz) |
Rogers RO4360G2 Material Introduction
Rogers RO4360G2 redefines high-Dk telecom material design by solving a key industry challenge: high performance without specialized processing. As the first high-Dk thermoset laminate processable like standard FR-4, it eliminates the need for costly, time-consuming fabrication steps (e.g., sodium etch for PTFE materials) while delivering the RF properties required for power amplifiers and transceivers.
Key material traits include:
Glass Reinforcement: Adds rigidity for easier handling in multi-layer constructions (and compatible with RO440 series prepreg/RO4000 low-Dk laminates for complex designs)
Lead-Free Compatibility: Aligns with global environmental regulations (e.g., RoHS) for telecom equipment
Cost Efficiency: Short lead times and efficient supply chains reduce material and production costs—critical for large-scale base station rollouts
Key Material Features
| Feature | Specification |
| Dielectric Constant (Dk) | 6.15 ± 0.15 at 10GHz/23°C |
| Dissipation Factor (DF) | 0.0038 at 10GHz/23°C |
| Thermal Performance | - Decomposition Temp (Td): >407°C- Glass Transition Temp (Tg): >280°C (TMA) |
| Thermal Conductivity | 0.75 W/mK |
| Coefficient of Thermal Expansion (CTE) | - X-axis: 13 ppm/°C- Y-axis: 14 ppm/°C- Z-axis: 28 ppm/°C (-55 to 288°C) |
| Flammability Rating | UL 94 V-0 |
| Process Compatibility | Lead-free process compatible; FR-4-like fabrication |
Core Benefits
High RF Efficiency: High Dk (6.15) enables compact RF circuit designs (critical for small cell transceivers) while low DF (0.0038) minimizes signal loss in power amplifiers
Plated Through-Hole (PTH) Reliability: Low Z-axis CTE (28 ppm/°C) and copper-matched X/Y CTE prevent PTH cracking during thermal cycling.
Automated Assembly Compatibility: FR-4-like processing works with standard SMT and thru-hole assembly lines, reducing production time for high-volume telecom orders.
Thermal Resilience: High Tg (>280°C) and Td (>407°C) withstand lead-free soldering and the heat generated by power amplifiers, preventing component failure.
Environmental Compliance: Lead-free and UL 94 V-0 rated, meeting global telecom safety and sustainability standards.
Some Typical Applications
- Base Station Power Amplifiers
- Small Cell Transceivers
The 2-layer PCB with Rogers RO4360G2 material is a telecom-optimized solution that bridges high performance and practicality.
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RO4360G2 PCB 2L 32mil Substrate Immersion Gold Finish Images
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